The Seoul Metropolitan Government has successfully secured the establishment of a semiconductor advanced packaging materials research and development center by Henkel, the renowned German multinational company. This significant initiative, valued at 12.1 billion won, aims to develop critical materials essential for artificial intelligence (AI) semiconductors and next-generation high-bandwidth memory (HBM). This endeavor is expected to enhance the competitive edge of domestic firms while reinforcing the stability of the supply chain amidst evolving technological demands.
On September 9, officials announced the forthcoming signing of a memorandum of understanding (MOU) with Henkel, marking a pivotal step in the collaboration aimed at bolstering semiconductor technology infrastructure in South Korea. The MOU signing ceremony was attended by key figures, including Kim Hyun-woo, head of economic policy for Seoul, and both co-CEOs of Henkel Korea, Kim Young-mi and Jang Ho-jun, reflecting the commitment of both parties to this ambitious project.
Founded in 1876, Henkel has established itself as a global leader in adhesives, consumer goods, and advanced materials, operating across 79 nations. With an impressive annual revenue of approximately €20.5 billion (around 30 trillion won), and a workforce numbering around 50,000, the company boasts substantial expertise in research and development, particularly in electronic materials that play a vital role in advanced manufacturing sectors.
Henkel Korea, a wholly owned subsidiary, has been integral to Henkel’s operations in the country since its establishment in 1989. The subsidiary manages multiple manufacturing and R&D facilities in key cities, including Seoul, Cheonan, Incheon, Eumseong, and Busan, and has consistently invested in innovative materials and R&D capabilities.
Under the newly signed agreement, Henkel plans to invest a total of 12.1 billion won by 2031, with goals to employ 15 highly specialized researchers, focusing on advanced packaging materials indispensable for AI semiconductors and HBM, such as high-performance electronic adhesives and thermal management solutions.
The R&D hub in Seoul is intended to facilitate deeper technological collaborations with local chip manufacturers as global demand for AI and HBM semiconductors escalates. The center’s objectives include developing materials tailored to the specific technical requirements of domestic clientele, expanding joint research efforts, and providing comprehensive technical support.
Moreover, the Seoul Metropolitan Government is actively pursuing diverse collaborative opportunities to ensure that Henkel’s investment translates into enhanced competitiveness for the local semiconductor sector. These initiatives will focus on technology localization of core packaging materials, cooperative research, and fostering talent through partnerships with local universities and research institutions.
Industry leaders emphasize the strategic importance of advancing material technology and securing stable supply chains to thrive in the AI semiconductor and HBM markets. The establishment of Henkel’s R&D center represents a crucial milestone in enhancing the research capacities within South Korea, encouraging technological advancements and creating quality job opportunities in this vital sector.
As the global semiconductor landscape continues to evolve, initiatives such as this position Korea among the frontrunners in advanced semiconductor innovation, driven by world-class talent and state-of-the-art research capabilities, paving the way for a robust future in technology development.
Media News Source.